HBM production is incredibly difficult because it faces extreme technical challenges at every stage: design (wide buses, complex power delivery), manufacturing (TSV yield, wafer thinning), testing (KGD, post-stack verification), and packaging (micro-bump alignment, CoWoS bottleneck), plus field failures, making it the most complex chip in the value chain—so why is everyone still surprised by the shortage?

#HBM #HBM3E #HBM4