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In this piece, Nutty explains why Intel is choosing to attack TSMC through the side door of packaging rather than taking on its leading node dominance head on.

The article breaks down why EMIB, Foveros, and hybrid bonding matter, and why the HBM4 era is turning memory base dies and advanced packaging into a new semiconductor battlefield.

If you want to understand Intel’s real capabilities and the power struggle unfolding in the advanced packaging era, this is a must read.

Jun 24
at
3:14 PM
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