This piece is an attempt to step back and look at the broader shifts now unfolding across the semiconductor industry.
The bottleneck is no longer just compute itself, but increasingly the connection between things.
I tried to bring HBM, advanced packaging, optics, interconnect, and power into one broader frame and show why they have all become important at the same time.
Most of the major pieces going forward will be published as paid posts on Substack.
Pledges are currently open, and subscription pricing will increase once the paid tier goes live.