Opportunity to gain insights into

• Solutions needed to address energy efficiency and other challenges impacting the next-generation AI chips and corresponding design flows and methodologies for TSMC A16™, N2, and N3 processes

• Consistent progress in design enablement and solution development for TSMC’s advanced processes including A14, TSMC A16™ and N2

• Latest advancements in design solutions on TSMC 3DFabric® chip stacking (including InFO, CoWoS®, TSMC-SoIC®, TSMC-SoW™), as well as updates on the TSMC 3DFabric Alliance

• AI-assisted design flows for 2D and 3DIC design productivity and optimization

• Design enablement technologies, IPs, and solutions targeting the latest HPC, AI/ML, automotive, mobile/5G and IoT applications

• Comprehensive design solutions for specialty technologies including ultra-low power, ultra-low voltage, analog migration, RF, and mmWave

• Successful, real-life applications of design technologies, IP solutions, and cloud-based designs from TSMC’s Open Innovation Platform® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market