MediaTek has secured orders for Google’s TPU v7e and v8e, and is exploring EMIB technology as a way to address CoWoS capacity bottlenecks.

MediaTek is currently recruiting engineers with expertise in Intel’s EMIB technology to support Google’s TPU production, signaling an increasingly close collaboration between the two sides.

Industry analyses further corroborate this view, highlighting EMIB as a cost-effective alternative for large-scale AI packaging. The adoption of EMIB-T in TPU v8e reflects a broader industry trend: as TSMC’s capacity remains tight, Intel’s advanced packaging technologies are gaining market recognition.

Sources also confirm that Intel’s EMIB technology has already been successfully deployed in its own products, laying the groundwork for future external growth.